At the Taipei Computer Show in early June, AMD officially introduced the Zen2 architecture, TSMC 7nm process of the third generation of Rex processors, and the processor was released alongside the X570 chipset. As one of AMD’s key products in 2019, the Ryzen 3000 series processors are the industry’s first CPUs to support PCIe 4.0 lanes, and the X570 motherboard is the first chipset to support PCIe 4.0 lanes. AMD Ryzen 3900X processor specifications For the third generation of Raidon processors, AMD brings the 6-core, 12-thread Ryzen 3600/Ryzen 3600X, the 8-core, 16-thread Ryzen 3700X/R The Chiplets package reduces the area of a single chip, lowering the manufacturing defect rate and lowering the chip’s manufacturing cost, providing gamers with a product with excellent performance at an affordable price.
AMD maintains its multi-core advantage, as evidenced by the Ryzen 3900X, which has 12 cores and 24 threads. The Ryzen 3900X processor still uses the AM4 interface, and Seven Rainbow provided the CVN X570 GAMING PRO V14 motherboard for testing. If the user does not have a strict requirement for PCIe 4.0 lanes, the AM4 interface of the 300 and 200 series motherboards can provide a more cost-effective combination for gamers. Motherboard Design Features The Seven Rainbow CVN X570 GAMING PRO V14 comes in a standard ATX form factor with a design inspired by aircraft carriers and is a motherboard designed for gamers.
The motherboard has a significant amount of metal cooling armor, with the cooling section covering the CPU power supply, M.2 hard drive interface, Southbridge chip, and sound card section, and the three PCIe X16 slots on the motherboard are reinforced with metal. The X570 chipset is the first chipset to support PCIe 4.0, AMD brings a doubled performance PCIe channel to the motherboard, in addition to the upgrade of the graphics slot, the M.2 interface NVMe SSD The X570 series motherboards are equipped with an independent cooling fan in the south bridge section to bring lower temperatures to the chipset, as PCIe 4.0 brings doubled bandwidth and a lot of heat.
The Southbridge fan on the CVN X570 GAMING PRO V14 motherboard is surrounded by a red metal ring, and the Southbridge heatsink is linked to the M.2 SSD heatsink to increase airflow to the M.2 and lower the temperature of the PCIe 4.0 SSD during operation. Both M.2 interfaces on the motherboard support PCIe 4.0 and are backward compatible with PCIe 3.0 box SATA mode, allowing different users to meet their needs. The motherboard also includes six SATA 6Gbps interfaces to provide users with extensive hard drive support, and the three PCIe x16 lanes are reinforced with metal tabs. The first supports 16 lanes of PCIe 4.0, bringing 32GB/s of bandwidth; the second supports 8 lanes of PCIe 4.0, bringing the same 16GB/s bandwidth as the x16 lanes of PCIe 3.0; and the third is 4 lanes of PCIe 4.0, bringing a total bandwidth of 8GB/s.
Seven rainbow CVN X570 GAMING PRO V14 motherboard rear 1 PS/2 interface, 2 USB2.0 interface, 1 DP interface
The CVN X570 GAMING PRO V14 motherboard includes a 10-phase hybrid digital power supply with F.C.C ferrite inductors and eight-pin L.R.T MOS tubes. In addition to a 2-phase VRM power supply, the output section employs 10K black gold solid state capacitors. To provide better cooling assistance for the MOS tubes, the CPU power supply section employs a split frost cooling armor.
The official claim is that this set of cooling armor can keep the power supply module cool and provide more stable voltage and current to the CPU. Motherboard BIOS settings The BIOS of the CVN X570 GAMING PRO V14 is in simple mode by default, and users can enter the detailed settings through the “Advanced” mode in the upper right corner.
Scores for motherboard/CPU test runs Test platform CPU: AMD Ryzen 3900X (12 cores and 24 threads) Heatsink: AMD Wraith Prism (Ghost Prism)
Seven Rainbow CVN X570 GAMING PRO V14 Motherboard Memory: Avenger DDR4-2400 8GB*2 Hard disk: Mindset Dictator 480GB Power supply: Apex AG-750M
Graphics card: iGame RTX 2070 SUPER Vulcan X OC Testing software: AIDA 64, CineBench R15, Fritz Chess BenchMark, WinRAR for performance testing, and AIDA 64 for stability testing. In the CPU-Z score, the R9 3900X single-core score differs from that of the i9 9900K, but considering the maximum acceleration of 4.6GHz for the 3900X and 5.0GHz for the 9900K, the Zen2 architecture AIDA 64 tests, I tested the motherboard with the R9 3900X in dual-channel DDR4-2400 memory bandwidth, the memory renewal speed of around 36GB / s, and latency of 91.8 nanoseconds. The R9 3900X processor has a maximum temperature of 81 degrees in the stress test, a stable main frequency of around 4GHz, and a maximum power consumption of 103.7W, which is very close to the TDP power consumption limit.
In CineBench R15 scores, the R9 3900X multi-core is still significantly ahead of the Intel i9 9900K, single-core performance also caught up with Coffee Lake, leading the previous generation Zen by about 17 percent. In chess scores, the Fritz Chess Bench supports up to 16 threads, so the multi-core advantage of the R9 3900X is reduced, and overall performance lags behind the i9-9900K, which also has up to 16 threads. The Zen2 architecture significantly improves the processor’s single-core performance when compared to the previous generation of Zen architecture, and it is coupled with a new generation of PCIe 4.0 channels, bringing greater bandwidth for graphics cards and PCIe channel products, allowing the processor to deliver better performance.
The motherboard is outfitted with the CVN X570 GAMING PRO V14, a continuation of the CVN series’ classic design, with a large number of cooling armor to reduce the motherboard’s temperature and improve stability. 10-phase F.C.C ferrite inductor and solid capacitors for the motherboard quality, stable current, to provide better protection for the processor overclock